New PDF release: Adhesives Technology for Electronic Applications: Materials,

By James J. Licari,Dale W. Swanson

ISBN-10: 0815515138

ISBN-13: 9780815515135

This publication is exclusive in its finished insurance of all points of adhesive know-how for microelectronic units and packaging, from thought to bonding to check tactics. as well as basic functions, corresponding to dies, substrate, and lid and chip stack attachments, the e-book contains new advancements in anisotropic, electrically conductive, and underfill adhesives. speedy curing equipment akin to UV, microwave, and moisture (which conform to present environmental and effort requisites) are lined. Over eighty tables and one hundred twenty figures supply a wealth of information on houses, functionality, and reliability. additionally integrated are examples of commercially to be had adhesives, providers, and gear. every one bankruptcy presents accomplished references.

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Download e-book for kindle: Adhesives Technology for Electronic Applications: Materials, by James J. Licari,Dale W. Swanson

This e-book is exclusive in its entire insurance of all facets of adhesive expertise for microelectronic units and packaging, from idea to bonding to check techniques. as well as basic functions, comparable to dies, substrate, and lid and chip stack attachments, the booklet contains new advancements in anisotropic, electrically conductive, and underfill adhesives.

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Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) by James J. Licari,Dale W. Swanson


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